
MG Chemicals 832C-375ML 胶带-产品快照
- 品牌:
- MG Chemicals
- 型号:
- 832C-375ML
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供应商名称 | 电话 | 备注 |
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暂无展示,可咨询在线客服 | 400-811-6961 |
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产品介绍
MG Chemicals 832C-375ML 胶带
NewMG Chemicals 2.55 L Clear Potting Compound
MG Chemicals
MG Chemicals Epoxy Potting Compounds The MG Chemicals two-part epoxy potting compound has been designed to protect your electronic components. The liquid electric grade 832 series epoxy protects your components against static discharges, fungus, thermal shocks, mechanical impact and vibrations. Feature and BenefitsImpact resistantNon-conductiveLow toxicityImproves reliability and operational rangeNon-porous, water and chemical resistantHard to removeAvailable in different colours Typical ApplicationsAviation IndustryCommunication IndustryMarine IndustryCar industry Note Refer to the datasheet for more details on how to apply and applications Caution Due to exothermic reaction, heat cure temperatures should be at least 25% below the maximum temperature tolerated by the most fragile PCB component. For larger potting blocks, reduce heat cure temperature by greater margins Potting Compounds The Potting Compounds are pourable two-part compounds for potting and encapsulating electronic circuits and components. They protect against moisture and corrosion and improve insulation resistance and mechanical strength. They may be cured at room temperature, or oven cured. Use silicone oil aerosol as a mould release agent. Full instructions supplied with each pack. Suitable disposable polyethylene gloves stock no. 613-3156 are available. ; Package Type Can; Package Size 2.55 L; Cure Time 35 min → 24 h; Colour Clear; Maximum Operating Temperature +145°C; Minimum Operating Temperature -30°C; Operating Temperature Range -30 → +145 °C; Setting Time 60min; Physical Form Liquid; Chemical Composition Alkyl Glycidyl Ether, Bisphenol A, C18-Unsaturated, Dimers, Epoxy Resin, Fatty Acids, Reaction Products with Polyethylenepolyamines, Triethylenetetramine; Viscosity Measurement 3300cP/s;
Adhesives, Sealants & Tapes>Adhesives & Glues>Potting Compounds