MOLEX莫仕  43045-0602

MOLEX莫仕 43045-0602-产品快照

品牌:
MOLEX
型号:
43045-0602

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供应商名称 电话 备注
得捷电子(上海)有限公司 400 920 1199
深圳市麦信实业有限公司
南京傲兴贸易有限公司 025-68567984
深圳凌创辉电子有限公司 0755-83218489 专业继电器、连接器分销商
上海贸泽电子有限公司
欧时电子元件(上海)有限公司
深圳市欧锘克电子有限公司 0755-83238622
深圳市行健自动化股份有限公司 0755-86336499
深圳捷迈科技发展有限公司 0755-86128820
上海优友实业发展有限公司 021-54011151
MASTER ELECTRONICS GROUP LIMITED 00852-35911702

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产品介绍

MOLEX莫仕 43045-0602

Molex MICRO-FIT 3.0 Series, Series Number 43045, 3mm Pitch 6 Way 2 Row Right Angle PCB Header, Solder Termination, 5A

Molex

Molex Micro-Fit 3.0 3.0mm Dual Row PCB Headers with Snap in Plastic Peg PCB Lock, 43045 Series Micro-Fit 3.0 3mm pitch wire to board dual row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, snap-in plastic peg PCB locks are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs Features and BenefitsHigh current carrying capacity in a small footprintHigh temperature housings for IR reflow solderingThrough hole versions SMT compatiblePositive latching for secure mating connectionFully isolated dual beam terminals for reliable electrical performance and contactPlastic peg PCB locks for secure connection to PCBGlow Wire Compliant ApplicationsThese Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:Military COTS (Commercial Off The Shelf)Solar powerConsumer products (dryers, freezers, fridges, washing machines)Data communications (routers, servers)MedicalTelecommunicationsGaming terminals Molex Micro-Fit 3.0 Series Voltage rating 250V a.c. (rms) or 176Vd.c. Contact resistance 10mΩ max. Current rating (per contact) Amps Insulation resistance 1000 MΩ min. 20//22 awg 5 Dielectric strength 1500V a.c. 24 awg 4 Contact material Tin plated phosphor bronze 26 awg 3 Housing material Polyester 94V-0 28 awg 2 Header material High temp LCP 30 awg 1     ; Number of Contacts 6; Pitch 3mm; Number of Rows 2; Type Wire to Board; Body Orientation Right Angle; Termination Method Solder; Current Rating 5A; Series Micro-Fit 3.0; CAD Drawing 3D CAD Model; Contact Material Brass Alloy; Voltage Rating 250 V ac/dc; Series Number 43045;

Connectors>PCB Connectors>PCB Headers

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