TE CONNECTIVITY泰科  167021-3 连接器

TE CONNECTIVITY泰科 167021-3 连接器-产品快照

品牌:
TE CONNECTIVITY
型号:
167021-3

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供应商名称 电话 备注
上海冠能实业有限公司
深圳捷迈科技发展有限公司 0755-86128820
欧时电子元件(上海)有限公司
易络盟电子(中国)有限公司
富昌电子(上海)有限公司 400 821 6206
北京澳硕科技有限公司 010-64304516
飞熠国际贸易(深圳)有限公司 0755-2653 2288
深圳凌创辉电子有限公司 0755-83218489 专业继电器、连接器分销商
MASTER ELECTRONICS GROUP LIMITED 00852-35911702

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产品介绍

TE CONNECTIVITY泰科 167021-3 连接器

TE Connectivity AMPMODU Mod IV PCB Connector Contact, Female, Crimp, Tin over Nickel Plating 32 → 28 AWG

TE Connectivity

Receptacle Crimp Contacts (Mod IV) A range of Receptacle Crimp Contacts for use with Mod IV shells which mate with shrouded headers. This range includes Crimps are for 32-28 or 26-22 or 24-20 AWG wires, see Table for details. Stock Number TE Part Number Wire Size & Insulation Diameter Max. Contact Plating: Mating Area, Remainder Pressure Form Mod Material 668-9725 167021-2 32-28 AWG [0.032-0.09 mm] & 1.2 mm 0.8 μm Gold, Gold Flash Intermediate Reel IV Ph Bz 668-9729 167021-3 32-28 AWG [0.032-0.09 mm] & 1.2 mm 2 μm Pre-tinned Intermediate Reel IV Ph Bz 668-9731 167301-4 24-20 AWG [0.2-0.56 mm] & 1.4 mm 0.8 μm Gold, Gold Flash Intermediate Reel IV Ph Bz 668-9735 2-167301-2 24-20 AWG [0.2-0.56 mm] & 1.4 mm 2 μm Pre-tinned Intermediate Reel IV Ph Bz 668-9738 167300-6 20-26 AWG [0.5mm max] & 1.4 mm 0.8 μm Gold, Gold Flash Standard Reel IV Ph Bz 778-0970 167300-8 20-26 AWG [0.5mm max] & 1.4 mm 0.8 μm Gold, Gold Flash Crimp Area only Standard Reel IV Ph Bz 680-2284 86016-2 24-20 AWG [0.2-0.6 mm ] & 1.75 mm 0.8 μm Gold, Gold Flash Standard Loose IV Be-Cu 680-0720 86016-3 24-20 AWG [0.2-0.6 mm ] & 1.75 mm 2 μm Pre-tinned Standard Loose IV Be-Cu 680-2281 86016-5 24-20 AWG [0.2-0.6 mm ] & 1.75 mm 0.4 μm Gold, Gold Flash Standard Loose IV Be-Cu 680-2348 87523-6 24-20 AWG [0.2-0.6 mm ] & 1.75 mm 2 μm Pre-tinned Standard Loose IV Cu-Sn-Ph-Br 718-9826 6-87523-9 24-20 AWG [0.2-0.6 mm ] & 1.75 mm 0.8 μm Gold, Tin Standard Loose IV Cu-Sn-Ph-Bz 680-2385 87667-3 26-22 AWG [0.12-0.4 mm ] & 1.55 mm 2 μm Pre-tinned Standard Loose IV Be-Cu 680-2388 87756-7 26-22 AWG [0.12-0.4 mm ] & 1.55 mm 2 μm Pre-tinned Standard Loose IV Cu-Sn-Ph-Br 718-9835 6-87756-6 26-22 AWG [0.12-0.4 mm ] & 1.55 mm 0.4 μm Gold, Tin Standard Loose IV Cu-Sn-Ph-Bz 680-0724 1-87309-3 24-20 AWG [0.2-0.6 mm ] & 1.75 mm 2 μm Pre-tinned High Loose V Ph Bz 680-1455 1-87309-4 24-20 AWG [0.2-0.6 mm ] & 1.75 mm 0.8 μm Gold, Gold Flash High Loose V Ph Bz 2.54mm TE Connectivity AMPMODU™ Range – Style 2 (European) A wide range of modular interconnects on the industry standard 2.54mm (0.1in ) Grid, addressing applications across all industry sectors. Designed for wire to board or board to board connection, including stacking. ; Gender Female; For Use With Connector Receptacles; Series AMPMODU MOD IV; Wire Size 32 → 28 AWG; Termination Method Crimp; Contact Plating Tin over Nickel; Contact Material Phosphor Bronze; Maximum Contact Resistance 12mΩ; Minimum Operating Temperature -65°C; Maximum Operating Temperature +105°C; CAD Drawing 3D CAD Model;

PCB Connector Contacts

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