
61 B 7146 热接合膜-产品快照
- 品牌:
- 61 B 7146
- 型号:
- 61 B 7146
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产品介绍
61 B 7146 热接合膜
Heat conducting wafer, TO 3P/TO 218/TO 247/TO 248, 24 x 21 mm, V8640/AV
61 B 7146
Ceramic heat conducting foils for semiconductors, type Assmann C20. For all standard applications; Features: silicon foil with high-grade glass fiber-reinforced ceramic filling, very low thermal transfer resistance, very flexible, non-combustible to UL 94 V-0, application of thermal transfer compound is not necessary. Material thickness: 0.2 mm. Color: dark red. Thermal transfer resistance: 0.30 to 0.35 °C. Tensile strength: 25.9 MPa. Tear resistance: 70 kN/m. Contact resistance: 1.8 x 10^12 ohm x m. Dielectric strength: 2.0 kV. Operating temperatures: –60 to +200 °C. Self-adhesive, type V86../AV. Adhesive strength on stainless steel: 200 to 300 g/cm². Technical attributes (type, for package size, dimensions): V8640/AV, TO 3P/TO 218/TO 247/TO 248, 24 x 21 mm
There are 754 piece in stock 435 348 267 229
Thermal joint films